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High-Speed Chip Shooter KE-3010A

Higher Speed, Higher Quality, Improved Capacity.

Placement Monitor Supported model Catalog download Contact

Features


 
Continued Evolution of the KE Series

Chip 23,500CPH chip (Laser centering / Optimum)
18,500CPH (Laser centering / IPC9850)
IC 9,000CPH (Vision centering / MNVC option)
  • From 0402(01005) to 33.5mm square components
  • One multi-nozzle laser head (6 nozzles)
  • The use of electronic double tape feeders enables mounting of a maximum of 160 component types.
  • High-speed, on-the-fly vision centering
    (When using both high-resolution camera and MNVC. (option))
  • Longer sized PWB in X axis (option)

specification

Board size M size (330×250mm) yes
L size (4FFF10×360mm) yes
L-Wide size (510×360mm) *1 yes
XL size (610×560mm) yes
Applicability to long PWB (M size)*2 650×250mm
Applicability to long PWB (L size)*2 800×360mm
Applicability to long PWB (L-Wide size)*2 1,010×360mm
Applicability to long PWB (XL size)*2 1,210×560mm
Component height 6mm yes
12mm yes
Component size Laser recognition 0402(01005) ~ □33.5mm
Vision recognition Standard camera 3mm*3 ~ □33.5mm
High-resolution camera 1.0×0.5mm*4 ~ □20mm
Placement speed Chip Optimum 23,500CPH
IPC9850 18,500CPH
IC *5 9,000CPH *6
Placement accuracy Laser recognition ±0.05 mm (±3σ)
Vision recognition ±0.04mm
Feeder inputs Max.160 in case of 8mm tape
(on a Electric double tape feeder)*7


*1 L-Wide size is optional
*2 Applicability to long PWB is optional.
*3 When using MNVC. (option)
*4 KE-3010A : When using both high-resolution camera and MNVC. (option)
*5 Effective tact : The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. (CPH=number of components placed for one hour)
*6 Estimated value when using MNVC and picking up components simultaneous with all nozzles.
MNVC is option in the KE-3010A.
*7 When using Electric double tape feeder EF08HD.
* PWB size XL will be KE-3010

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