JUKI released ” New High Speed Flexible Mounters KE-2070/KE-2080 “
High-Speed Chip Shooter KE-2070
A chip mounter optimal for high-speed mounting of small parts.
Placement Monitor Supported model
Features
With the addition of the optional MNVC, the component range can be increased even more for greater flexibility.
- Chip
23,300CPH（laser centering/Optimum）（0.155Sec./chip）
18,300CPH（laser centering/IPC 9850） - IC
4,600CPH (vision centering with optional MNVC) - One multi-nozzle laser head (6 nozzles)
- From 0402 (01005) to 33.5mm square components
- Vision centering system (optional, featuring bottom, side, and back lighting, all ball recognition)
※1 Actual throughput may vary.
※2 Please download brochure for details.
Specifications
| Board size | M size (330×250mm) | ○ | |
|---|---|---|---|
| L size (410×360mm) | ○ | ||
| L-Wide size(510×360mm) (option) | ○ | ||
| E size (510×460mm)*1 | ○ | ||
| Component size | Laser recognition | 0402 (01005) ～□33.5mm | |
| Vision recognition | Standard camera |  □3mm*2 ～□33.5mm |
|
| High-resolution camera (option) | 1.0×0.5mm*3 ～□20mm |
||
| Placement speed | Chip | Optimum | 0.155Sec./chip(23,300CPH) |
| IPC9850 | 18,300CPH | ||
| IC*4 | 4,600CPH*5 |
||
| Placement accuracy | Laser recognition | ±0.05mm（Cpk≧1） | |
| Vision recognition | ±0.04mm | ||
| Feeder inputs | Max. 80 on 8mm T/F*6 | ||
*1 Please ask for details on E size board.
*2 When using MNVC. (option)
*3 When using both high-resolution camera and MNVC. (option)
*4 Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
(CPH=number of components placed for one hour)
*5 Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
*6 Including matrix tray changer, max 110.
High-Speed Flexible Mounter KE-2080
The best flexible placement system for high-density placements.
Placement Monitor Supported model
Features
The ultra-flexible KE-2080 can place a wide range of components from 0402 (01005) and ICs, to odd-form,
all at industry leading accuracy and speed.
- Chip
20,200CPH（laser centering/Optimum）（0.178Sec./chip)
16,700CPH（laser centering/IPC9850） - IC
1,850CPH (vision centering / effective tact)
4,860CPH with MNVC option. - One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
- From 0402 (01005) to 74mm square components or 50×150mm
- Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)
※1 Actual throughput may vary.
※2 Please download brochure for details.
Specifications
| Board size | M size (330×250mm) | ○ | |
|---|---|---|---|
| L size (410×360mm) | ○ | ||
| L-Wide size(510×360mm) (option) | ○ | ||
| E size (510×460mm)*1 | ○ | ||
| Component size | Laser recognition | 0402 (01005)～33.5mm | |
| Vision recognition | Standard camera | □3mm～□74mm or 50×150mm | |
| High-resolution camera (option) | 1.0×0.5mm*3～□48mm or 24×72mm | ||
| Placement speed | Chip | Optimum | 0.178Sec./chip(20,200CPH) |
| IPC9850 | 16,700CPH | ||
| IC*4 | 1,850CPH | ||
| 4,860CPH*5 |
|||
| Placement accuracy | Laser recognition | ±0.05mm（Cpk≧1） | |
| Vision recognition | ±0.03mm (±0.04mm when using MNVC) | ||
| Feeder inputs | Max. 80 on 8mm T/F*6 | ||
*1 Please ask for details on E size board.
*2 When using MNVC. (option)
*3 When using high-resolution camera. (option)
*4 Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
(CPH=number of components placed for one hour)
*5 Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
*6 Including matrix tray changer, max 110.