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2080   Brochures contact

The best flexible placement system for high-density placements.
Placement Monitor Supported model

Feature High resolution head RaserCentering VisionCentering
Nozzle The ultra-flexible KE-2080 can place a wide range of components from 0402 (01005) and ICs, to odd-form,
all at industry leading accuracy and speed.
  20,200CPH(laser centering/Optimum)(0.178Sec./chip)
  16,700CPH(laser centering/IPC9850)
  1,850CPH (vision centering / effective tact)
    4,860CPH with MNVC option.
  One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
  From 0402 (01005) to 74mm square components or 50×150mm
  Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)
※1 Actual throughput may vary.
※2 Please download brochure for details.
Board size M size (330×250mm)
L size (410×360mm)
L-Wide size(510×360mm) (option)
E size (510×460mm)*1
Component size Laser recognition 0402 (01005)~33.5mm
Vision recognition Standard camera □3mm~□74mm or 50×150mm
High-resolution camera (option) 1.0×0.5mm*3~□48mm or 24×72mm
Placement speed Chip Optimum 0.178Sec./chip(20,200CPH)
IPC9850 16,700CPH
IC*4 1,850CPH
Placement accuracy Laser recognition ±0.05mm(Cpk≧1)
Vision recognition ±0.03mm (±0.04mm when using MNVC)
Feeder inputs Max. 80 on 8mm T/F*6
*1   Please ask for details on E size board.
*2   When using MNVC. (option)
*3   When using high-resolution camera. (option)
*4   Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
    (CPH=number of components placed for one hour)
*5   Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
*6   Including matrix tray changer, max 110.
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