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High-precision compact mounter that can be used flexibly for prototyping, variety and variable quantity production. It has a compact body with a height of 1.3 m and saves installation space approx. |
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| 30% compared with previous models. It can be operated, moved and laid out easily. It has high placement precision equivalent to higher models, so it can place the latest components, such as 0603 chips. |
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0.76 Sec. / Component: chip （laser centering/optimal） |
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2.00 Sec. / Component: IC （Vision centering/optimal） |
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One laser alignment sensor （1 nozzles）plus One VCS (Vision Centering System) Camera |
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from 0603 （0201） to 50mm square components |
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| ※ Actual throughput may vary. |
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| Board size |
Max |
203.2×152.4mm |
| Min |
50×30mm |
| Component size |
Laser recognition |
0603 (0201)～□20mmor 23.5×11mm |
| Vision recognition |
□3mm～□24mm （□50mm*1） |
| Placement speed |
Laser recognition |
0.76 sec./component （optimum condition） |
| Vision recognition |
2 sec./component （optimum condition） |
| Placement accuracy |
Laser recognition |
±0.05mm |
| Vision recognition |
±0.04mm |
| Feeder inputs |
Max. 40 on 8mm T/F*2 |
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When using large VCS camera. |
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| *2 |
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20 on 8mm T/F if the size of board is (X)330mm x (Y)250mm. |
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| >> Contact |
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