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The ultra-flexible KE-2080 can place a wide range of components from 0402 (01005) and ICs, to odd-form,
all at industry leading accuracy and speed. |
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Chip |
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20,200CPH（laser centering/Optimum）（0.178Sec./chip) |
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16,700CPH（laser centering/IPC9850） |
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IC |
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1,850CPH (vision centering / effective tact) |
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4,860CPH with MNVC option. |
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One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle) |
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From 0402 (01005) to 74mm square components or 50×150mm |
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Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition) |
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| ※1 Actual throughput may vary. |
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| ※2 Please download brochure for details. |
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| Board size |
M size (330×250mm) |
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| L size (410×360mm) |
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| L-Wide size(510×360mm) (option) |
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| E size (510×460mm)*1 |
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| Component size |
Laser recognition |
0402 (01005)～33.5mm |
| Vision recognition |
Standard camera |
□3mm～□74mm or 50×150mm |
| High-resolution camera (option) |
1.0×0.5mm*3～□48mm or 24×72mm |
| Placement speed |
Chip |
Optimum |
0.178Sec./chip(20,200CPH) |
| IPC9850 |
16,700CPH |
| IC*4 |
1,850CPH |
 4,860CPH*5 |
| Placement accuracy |
Laser recognition |
±0.05mm（Cpk≧1） |
| Vision recognition |
±0.03mm (±0.04mm when using MNVC) |
| Feeder inputs |
Max. 80 on 8mm T/F*6 |
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Please ask for details on E size board. |
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When using MNVC. (option) |
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When using high-resolution camera. (option) |
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Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. |
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(CPH=number of components placed for one hour) |
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Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles. |
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Including matrix tray changer, max 110. |
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| >> Contact |
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