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A chip mounter optimal for high-speed mounting of small parts.
Placement Monitor Supported model

feature Lazer centering Vision centring
Nozzle With the addition of the optional MNVC, the component range can be increased even more for greater flexibility.
  Chip MNVC
  23,300CPH(laser centering/Optimum)(0.155Sec./chip)

18,300CPH(laser centering/IPC 9850)

  4,600CPH (vision centering with optional MNVC)
  One multi-nozzle laser head (6 nozzles)
  From 0402 (01005) to 33.5mm square components
  Vision centering system (optional, featuring bottom, side, and back lighting, all ball recognition)
※1 Actual throughput may vary.
※2 Please download brochure for details.
Board size M size (330×250mm)
L size (410×360mm)
L-Wide size(510×360mm) (option)
E size (510×460mm)*1
Component size Laser recognition 0402 (01005) ~□33.5mm
Vision recognition Standard camera □3mm*2 ~□33.5mm
High-resolution camera (option) 1.0×0.5mm*3 ~□20mm
Placement speed Chip Optimum 0.155Sec./chip(23,300CPH)
IPC9850 18,300CPH
IC*4  4,600CPH*5
Placement accuracy Laser recognition ±0.05mm(Cpk≧1)
Vision recognition ±0.04mm
Feeder inputs Max. 80 on 8mm T/F*6
*1   Please ask for details on E size board.
*2   When using MNVC. (option)
*3   When using both high-resolution camera and MNVC. (option)
*4   Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
    (CPH=number of components placed for one hour)
*5   Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
*6   Including matrix tray changer, max 110.
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