 |
|
|
 |
|
The best flexible placement system for high-density placements. |
|
 |
|
|
|
|
 |
|
|
|
The ultra-flexible KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed.
|
| |
| ■ |
|
12,500CPH：chip (laser centering/effective tact) |
|
| ■ |
|
1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option. |
|
| ■ |
|
One multi-nozzle laser head (4 nozzles) plus one high resolution head (1 nozzle) |
|
| ■ |
|
from 0603 （0201） to 74mm square components or 50×150mm
0402 (01005) option factory installed. |
|
| ■ |
|
Vision centering system (featuring bottom, side, and back lighting, ball recognition and split recognition) |
|
| ※1 Actual throughput may vary. |
|
| ※2 Please download brochure for details. |
|
|
|
|
 |
|
| Board size |
M size (330×250mm) |
○ |
L size (410×360mm) |
○ |
L- wide (510×360mm) |
○ |
E size (510×460mm)*1 |
○ |
| Component size |
Laser recognition |
0603 (0201)～□20mm or 26.5×11mm
(0402 (01005) optional)*5 |
Vision recognition |
1.0×0.5mm*2～□20mm or 26.5×11mm |
| Placement speed |
Chip |
12,500CPH*2 |
IC |
3,290CPH*3 |
| Placement accuracy |
Laser recognition |
±0.05mm |
Vision recognition |
±0.04mm |
| Feeder inputs |
Max. 80 on 8mm T/F*4 |
|
|
| *1 |
|
Production arrangement starts only after receipt of P/O for E size board. |
|
|
| *2 |
|
Effective tact: The chip placement speed indicates an estimated value obtained when the machine places 400 1005-chips all over an M size board. |
|
| |
|
（CPH＝number of components placed for one hour） |
|
|
| *3 |
|
Estimated value when using MNVC and picking up components simultaneous with all nozzles. |
|
|
| *4 |
|
In addition to matrix tray changer, max 110. |
|
|
| *5 |
|
Please ask for details on 0402(01005) placement. |
|
|
| >> Contact |
|
