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The best flexible placement system for high-density placements.

KE-2060
Feature Features of the KE-2000 series Laser centering Vision centering
The ultra-flexible KE-2060 can place a wide range of components from 0603 and ICs, to odd-form, all at a high rate of speed.
 
  12,500CPH:chip (laser centering/effective tact)
  1,850CPH: IC (vision centering/effective tact), 3,400CPH with MNVC option.
  One multi-nozzle laser head (4 nozzles) plus one high resolution head (1 nozzle)
  from 0603 (0201) to 74mm square components or 50×150mm
0402 (01005) option factory installed.
  Vision centering system (featuring bottom, side, and back lighting, ball recognition and split recognition)
※1 Actual throughput may vary.
※2 Please download brochure for details.
Specifications
Board size

M size (330×250mm)

L size (410×360mm)

L- wide (510×360mm)

E size (510×460mm)*1

Component size

Laser recognition

0603 (0201)~□20mm or 26.5×11mm
(0402 (01005) optional)*5

Vision recognition

1.0×0.5mm*2~□20mm or 26.5×11mm

Placement speed

Chip

12,500CPH*2

IC

3,290CPH*3

Placement accuracy

Laser recognition

±0.05mm

Vision recognition

±0.04mm

Feeder inputs Max. 80 on 8mm T/F*4
*1   Production arrangement starts only after receipt of P/O for E size board.
*2   Effective tact: The chip placement speed indicates an estimated value obtained when the machine places 400 1005-chips all over an M size board.
    (CPH=number of components placed for one hour)
*3   Estimated value when using MNVC and picking up components simultaneous with all nozzles.
*4   In addition to matrix tray changer, max 110.
*5   Please ask for details on 0402(01005) placement.
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