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High speed small chip placement system.

KE-2050
Feature Features of the KE-2000 series Laser centering
The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs.
  13,200CPH:chip (laser centering/effective tact)
  One multi-nozzle laser head (4 nozzles)
  from 0603 (0201) to 20mm square components or 26.5×11mm
0402 (01005) option factory installed.
※1 Actual throughput may vary.
※2 Please download brochure for details.
 
Specification

Board size

M size (330×250mm)

L size (410×360mm)

L -wide (510×360mm)

E size (510×460mm)

Component size

Laser recognition

0603~□20mm or 26.5×11mm
(0402 (01005) optional)*2

Placement speed

Chip

13,200CPH*1

Placement accuracy

Laser recognition

±0.05mm

Feeder inputs

Max. 80 on 8mm T/F

※1 Effective tact:The chip placement speed indicates an estimated value obtained when the machine places 400 1608-chips all over an M size board.
(CPH=number of components placed for one hour)
※2 Please ask for details on 0402(01005) placement.
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