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High speed small chip placement system. |
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| The KE-2050 is typically used as a compliment to the KE-2060 to increase overall throughput by placing the higher volume small chip components SOTs and ICs. |
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13,200CPH：chip (laser centering/effective tact) |
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One multi-nozzle laser head (4 nozzles) |
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from 0603 （0201） to 20mm square components or 26.5×11mm
0402 (01005) option factory installed.
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| ※1 Actual throughput may vary. |
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| ※2 Please download brochure for details. |
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Board size |
M size (330×250mm) |
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L size (410×360mm) |
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L -wide (510×360mm) |
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E size (510×460mm) |
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Component size |
Laser recognition |
0603～□20mm or 26.5×11mm
(0402 (01005) optional)*2 |
Placement speed |
Chip |
13,200CPH*1 |
Placement accuracy |
Laser recognition |
±0.05mm |
Feeder inputs |
Max. 80 on 8mm T/F |
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Effective tact：The chip placement speed indicates an estimated value obtained when the machine places 400 1608-chips all over an M size board.
(CPH＝number of components placed for one hour) |
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Please ask for details on 0402(01005) placement. |
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| >> Contact |
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