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Core design for ultra-high density placement.
Technology for high density placement.

Productivity

Ultra-rigid frame

Single molded casting Y-axis frames allows for 40% improvement in the gantry rigidity. Providing a 20% increase in axis speed and minimizes overall machine vibration. (compared to conventional models)

Ultra-rigid frame
High accuary

Dual XY drive system & independently driven heads

X-Y drive system features JUKI’s original “Full closed loop control” using AC motors and magnetic linear encoders. Dual motor drive of both X and Y achieves high-speed, and highly reliable placements unaffected by dust and temperature variations. Independent Z and θ motors improve accuracy and robustness.

Dual XY drive system & independently driven heads

No-blow placement technology

JUKI’s original vacuum self-calibration function eliminates the need for a vacuum “blowing-off” during placement, which can disturb neighboring components or solder paste.

Independent Z/θcontrol

Flexobility

Fiducial recognition

OCC lighting system supports wide variety of board materials including FPC (Flexible Printed Circuit board). Programmable brightness and directional lighting improves fiducial recognition.

Fiducial recognition
High quality

No-blow placement technology

JUKI’s original vacuum self-calibration function eliminates the need for a vacuum “blowing-off” during placement, which can disturb neighboring components or solder paste.

High density placement without “blowing-off”High density placement without “blowing-off”
High density placement without “blowing-off”
Possible effects of “blowing-off”

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