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FX-3がGlobal Technology Award 2008 高速機部門の優秀賞を受賞
FX-3 Receives 2008 Global Technology Award in the High-Volume Division
The 2008 Global Technology Award ceremony organized by Global SMT & Packaging Magazine was held during the NEPCON/EMT SOUTH CHINA exhibition, which took place in Shenzhen, China between August 26 and 29, 2008. JUKI’s latest machine, the FX-3 High-speed Modular Mounter, received a Merit Award in the Pick & Place Equipment — High-Volume category. Global Technology Award 2008
FX-3・FX-3・KE-2080
The FX-3 tackles the realization of optimum and highest-speed operation as one frame of a module by realizing high production throughput and giving consideration to area productivity. The FX-3 is based on a highly rigid frame and utilizes a new generation of linear motors on all the XY axes.
The FX-3 tackles the realization of optimum and highest-speed operation as one frame of a module by realizing high production throughput and giving consideration to area productivity. The FX-3 is based on a highly rigid frame and utilizes a new generation of linear motors on all the XY axes.
High-speed Modular Mounter FX-3
4-head, 4-beam, 2-station configuration laser align sensor (LNC60)
The FX-3 is designed in a 4-head, 4-beam, 2-station configuration using proven technology of the laser align sensor (LNC60) for component centering. This allows the 6 nozzles in each head to simultaneously center components at an optimum throughput of 0.049 seconds/chip (74,000CPH) or 60,000CPH based on IPC9850.
Many hardware and software components are compatible between the FX-3 and previous generations of SMT machines, giving the users both flexibility and continuing use of existing assets.
Nozzles Feeders HLC(Host Line Computer)
JUKI first introduced its medium-sized KE Series flexible mounters with outstanding expandability and versatility in 1993. In 2003, JUKI began selling its first high-speed modular mounter, the FX-1R, which supported high product changeover, small-lot manufacturing and the increasing use of smaller components. Since that time, the trend toward smaller components has continued while the requirement for higher assembly speed and reduced production costs has increased even further.
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